Fabrication of gated cathode structures using an in situ grown vertically aligned carbon nanofiber as a field emission element

被引:44
作者
Guillorn, MA [1 ]
Simpson, ML
Bordonaro, GJ
Merkulov, VI
Baylor, LR
Lowndes, DH
机构
[1] Univ Tennessee, Dept Elect & Comp Engn, Knoxville, TN 37996 USA
[2] Oak Ridge Natl Lab, Div Instrumentat & Controls, Oak Ridge, TN 37831 USA
[3] Cornell Univ, Cornell Nanofabricat Facil, Ithaca, NY 14853 USA
[4] Oak Ridge Natl Lab, Div Solid State, Oak Ridge, TN 37831 USA
[5] Oak Ridge Natl Lab, Div Fus Energy, Oak Ridge, TN 37831 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 02期
基金
奥地利科学基金会; 美国国家科学基金会;
关键词
D O I
10.1116/1.1358855
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Vertically aligned carbon nanofibers (VACNFs) are extremely promising cathode materials for microfabricated field emission devices, due to their low threshold field to initiate electron emission, inherent stability, and ruggedness, and relative ease of fabrication at moderate growth temperatures. We report on a process for fabricating gated cathode structures that uses a single in situ grown carbon nanofiber as a field emission element. The electrostatic gating structure was fabricated using a combination of traditional micro- and nanofabrication techniques. High-resolution electron beam lithography was used to define the first layer of features consisting of catalyst sites for VACNF growth and alignment marks for subsequent photolithography steps. Following metallization of these features, plasma enhanced chemical vapor deposition (PECVD) was used to deposit a 1-mum-thick interlayer dielectric. Photolithography was then used to expose the gate electrode pattern consisting of 1 mum apertures aligned to the buried catalyst sites. After metallizing the electrode pattern the structures were reactive ion etched until the buried catalyst sites were released. To complete the devices, a novel PECVD process using a de acetylene/ammonia/helium plasma was used to grow single VACNFs inside the electrostatic gating structures. The issues associated with the fabrication of these devices are discussed along with their potential applications. (C) 2001 American Vacuum Society.
引用
收藏
页码:573 / 578
页数:6
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