Sub-0.1 μ electron-beam lithography for nanostructure development

被引:21
作者
Peckerar, M [1 ]
Bass, R
Rhee, KW
机构
[1] USN, Res Lab, Div Elect Sci & Technol, Washington, DC 20375 USA
[2] SFA Inc, Largo, MD 20774 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2000年 / 18卷 / 06期
关键词
D O I
10.1116/1.1321278
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article discusses those factors that lead to resolvability in e-beam lithography. The primary tool of study is the simplex method of linear optimization theory. Resist exposure characteristics can effectively be accounted fur using a "minimum contrast" approach. The simplex exposure technique does not require exposure in the normally unexposed field. Feature linearity comparison experiments and boundary placement studies show measurable improvement with simplex when compared to dose scaling or feature boundary resizing. While computational tractability is a significant issue, the technique will rapidly assess whether small groups of features are resolvable. In addition, simplex points to general rules for applying dose modulation to different classes of features. [S0734-211X(00)12106-7].
引用
收藏
页码:3143 / 3149
页数:7
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