Technologies for cofabricating MEMS and electronics

被引：185

作者：

Fedder, Gary K. ^{[1
]}

Howe, Roger T. ^{[2
]}

Liu, Tsu-Jae King ^{[3
]}

Quevy, Emmanuel P. ^{[4
]}

机构：

[1] Carnegie Mellon Univ, Dept Elect & Comp Engn, Pittsburgh, PA 15213 USA

[2] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA

[3] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA

[4] Silicon clocks Inc, Fremont, CA 94538 USA

来源：

PROCEEDINGS OF THE IEEE | 2008年 / 96卷 / 02期

关键词：

integrated circuit fabrication; microelectromechanical systems (MEMS); micromachining;

D O I：

10.1109/JPROC.2007.911064

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microfabrication technologies initially developed for integrated electronics have been successfully applied to batch-fabricate a wide variety of micromechanical structures for sensing, actuating, or signal-processing functions such as filters. By appropriately combining the deposition, etching, and lithography steps for microelectromechanical devices with those needed for microelectronic devices, it is possible to fabricate an integrated microsystern in a single process sequence. This paper reviews the strategies for cofabrication, with an emphasis on modular approaches that do not mix the two process sequences. The integrated processes are discussed using examples of physical sensors (infrared imagers and inertial sensors), chemical and biochemical sensors, electrostatic and thermal actuators for displays and optical switching, and nonvolatile memories. By adding new functionality to integrated electronics, the use of microelectromechanical systems is opening new applications in sensing and actuating, as well as enhancing the performance of analog and digital integrated circuits.

引用

页码：306 / 322

页数：17

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