Characteristics of Ta-based amorphous alloy film for x-ray mask absorbers

被引:7
作者
Iba, Y [1 ]
Kumasaka, F [1 ]
Iizuka, T [1 ]
Aoyama, H [1 ]
Yamabe, M [1 ]
机构
[1] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1998年 / 16卷 / 06期
关键词
D O I
10.1116/1.590484
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We examined Ta-based amorphous alloy films and studied their characteristics for application in an x-ray mask with dimensions of the 0.1 mu m design rule. From the viewpoint of x-ray absorption, Ge is a suitable element for a compound with Ta. We found that a Ge inclusion atomic ratio of 20%-30% in a Ta-Ge compound film was suitable with respect to stress control and stress stability. It was possible to adjust the stress of the Ta-Ge film after deposition by annealing it at high temperature while maintaining control as good as 0.56 MPa/degrees C. During pattern fabrication by dry etching, it was possible to successfully etch the Ta-Ge film with a single-layer resist using a chroline based plasma, and scale patterns of 0.1 mu m were obtained. (C) 1998 American Vacuum Society. [S0734-211X(98)16906-8].
引用
收藏
页码:3495 / 3499
页数:5
相关论文
共 11 条
[1]   Method for fabricating a low stress x-ray mask using annealable amorphous refractory compounds [J].
Dauksher, WJ ;
Resnick, DJ ;
Cummings, KD ;
Baker, J ;
Gregory, RB ;
Theodore, ND ;
Chan, JA ;
Johnson, WA ;
Mogab, CJ ;
Nicolet, MA ;
Reid, JS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (06) :3103-3108
[2]  
HENKE RL, 1982, AT DATA NUCL DATA TA, V27
[3]   Origin of stress distribution in sputtered x-ray absorber film [J].
Iba, Y ;
Kumasaka, F ;
Aoyama, H ;
Taguchi, T ;
Yamabe, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (06) :2483-2488
[4]   Precise stress control of Ta absorber using low stress alumina etching mask for X-ray mask fabrication [J].
Iba, Y ;
Kumasaka, F ;
Aoyama, H ;
Taguchi, T ;
Yamabe, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (12B) :6463-6468
[5]   Pattern etching of Ta X-ray mask absorber on SiC membrane by inductively coupled plasma [J].
Iba, Y ;
Kumasaka, F ;
Aoyama, H ;
Taguchi, T ;
Yamabe, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1998, 37 (7A) :L824-L826
[6]   REDUCTION IN X-RAY MASK DISTORTION USING AMORPHOUS WN-CHI ABSORBER STRESS COMPENSATED WITH ION-BOMBARDMENT [J].
KANAYAMA, T ;
SUGAWARA, M ;
ITOH, J .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (01) :174-177
[7]   STRESS-FREE AND AMORPHOUS TA4B OR TA8SIB ABSORBERS FOR X-RAY MASKS [J].
SUGAWARA, M ;
KOBAYASHI, M ;
YAMAGUCHI, YI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1989, 7 (06) :1561-1564
[8]   Stress control and etching study of W-Re as X-ray mask absorber [J].
Sugihara, S ;
Murooka, K ;
Itoh, M ;
Higashikawa, I ;
Gomei, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (12B) :6716-6719
[9]  
TSUYUZAKI H, 1997, INT WORKSH XRAY EXTR
[10]   SPUTTERED W-TI FILM FOR X-RAY MASK ABSORBER [J].
YABE, H ;
MARUMOTO, K ;
AYA, S ;
YOSHIOKA, N ;
FUJINO, T ;
WATAKABE, Y ;
MATSUI, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (12B) :4210-4214