The adhesion between electrolessly deposited copper and a photoimageable polymer

We investigated the relationship between the peel adhesion of copper, deposited by electroless plating, to a photoimageable polymer and the time of chemical etching before plating. Mechanical interlocking is generally considered as being the adhesion mechanism between deposited metals and substrates. However, we found that the peel strength decreased with an increase in the etching time though the polymer roughness did not change. The glass transition temperature of the photoimageable polymer became lower as the etching time increased. The pretreatment not only roughened the surface of the photoimageable polymer, but also affected the bulk polymer and the adhesion.