Characterization of W films on Si and SiO2/Si substrates by X-ray diffraction, AFM and blister test adhesion measurements

Contrary to most classical adhesion test, the blister test provides quantitative adhesion energy measurements. We demonstrate its application to 1 mu m thick W films in tensile stress state deposited by xenon DC magnetron sputtering on PECVn/Si(100) substrates. The W films surface morphology; structure and residual stress were also characterized by atomic force microscopy, X-ray diffraction and substrate curvature measurements as function of the deposition pressure. Films characteristics are compared with those of W films deposited directly on Si(100) substrates.