Multiscale modeling of thin-film deposition: Applications to Si device processing

被引：74

作者：

Baumann, FH

Chopp, DL

de la Rubia, TD

Gilmer, GH

Greene, JE

Huang, H

Kodambaka, S

O'Sullivan, P

Petrov, I

机构：

[1] Bell Laboratories, Holmdel, NJ

[2] Department of Mechanical Engineering, Hong Kong Polytechnic University

[3] Bell Labs, Murray Hill, NJ

来源：

MRS BULLETIN | 2001年 / 26卷 / 03期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1557/mrs2001.40

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：182 / 189

页数：8

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