HBT thermal element design using an electro/thermal simulator

被引:15
作者
Anholt, R [1 ]
机构
[1] Gateway Modeling Inc, Minneapolis, MN 55414 USA
关键词
D O I
10.1016/S0038-1101(98)00093-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A thermal simulator for radially-symmetric HBTs is described which solves heat conduction equations in cylindrical coordinates. The simulator is coupled to a Poisson-current-continuity equation solver, which also uses cylindrical coordinates, so that we can compute thermal impedances for realistic power distributions. We obtain good agreement between modeled and measured thermal impedances for thermally-shunted HBTs with single emitter dots. We examine about 40 different design cases, allowing us to determine what features of the HBT and thermal design most reduce the thermal impedances. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:857 / 864
页数:8
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