Properties of poly(urea-formaldheyde) microcapsules containing an epoxy resin

被引:78
作者
Cosco, S.
Ambrogi, V.
Musto, P.
Carfagna, C.
机构
[1] Univ Naples Federico II, Dept Mat & Prod Engn, I-80125 Naples, Italy
[2] CNR, Inst Chem & Technol Polymers, I-80125 Naples, Italy
关键词
microencapsulation; emulsion polymerization; infrared spectroscopy; resins; Raman spectroscopy;
D O I
10.1002/app.26263
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Physical properties of urea-formaldehyde microcapsules containing an epoxy resin are presented and discussed. Microcapsules were prepared by in situ polymerization of monomers in an oil-in-water emulsion. Differential scanning calorimetry, thermogravimetric analysis, and scanning electronic microscopy were applied to investigate thermal and morphological microcapsule properties. Microencapsulation was detected by means of FTIR and Raman techniques. It was found that the amount of encapsulated epoxy resin as well as the extent of urea-formaldehyde polymerization depends on the reaction temperature and the stirring speed. (c) 2007 Wiley Periodicals, Inc.
引用
收藏
页码:1400 / 1411
页数:12
相关论文
共 43 条
[21]   MINIATURIZED TOTAL CHEMICAL-ANALYSIS SYSTEMS - A NOVEL CONCEPT FOR CHEMICAL SENSING [J].
MANZ, A ;
GRABER, N ;
WIDMER, HM .
SENSORS AND ACTUATORS B-CHEMICAL, 1990, 1 (1-6) :244-248
[22]   AN ALGORITHM FOR LEAST-SQUARES ESTIMATION OF NONLINEAR PARAMETERS [J].
MARQUARDT, DW .
JOURNAL OF THE SOCIETY FOR INDUSTRIAL AND APPLIED MATHEMATICS, 1963, 11 (02) :431-441
[23]  
MAY CA, 1988, HDB EPOXY RESINS CHE
[24]  
MEYER B, 1979, UREA FORMALDEHYDE RE
[25]  
PARK SJ, 2003, MICROSPHERES MICROCA, V6, P157
[26]  
PIZZI A, 1983, WOOD ADHESIVES CHEM, P59
[27]   The kinetics and mechanism of cure of an amino-glycidyl epoxy resin by a co-anhydride as studied by FT-Raman spectroscopy [J].
Rocks, J ;
Rintoul, L ;
Vohwinkel, F ;
George, G .
POLYMER, 2004, 45 (20) :6799-6811
[28]   Oral vaccine delivery [J].
Russell-Jones, GJ .
JOURNAL OF CONTROLLED RELEASE, 2000, 65 (1-2) :49-54
[29]   UREA RESORCINOL FORMALDEHYDE ADHESIVES OF LOW RESORCINOL CONTENT [J].
SCOPELITIS, E ;
PIZZI, A .
JOURNAL OF APPLIED POLYMER SCIENCE, 1993, 48 (12) :2135-2146
[30]   THE IMPORTANCE OF COMPLEMENTARY ASSETS IN THE DEVELOPMENT OF SMART TECHNOLOGY [J].
SHEEN, MR ;
MACBRYDE, JC .
TECHNOVATION, 1995, 15 (02) :99-109