Signal Integrity and design consideration of an MCM for video graphic acceleration

被引：14

作者：

Yang, Z ^{[1
]}

Rahman, M

Mourad, S

机构：

[1] Santa Clara Univ, Dept Elect Engn, Santa Clara, CA 95051 USA

[2] S3 Graph, Santa Clara, CA 95054 USA

[3] Santa Clara Univ, Dept Elect Engn, Santa Clara, CA 95053 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2001年 / 24卷 / 03期

关键词：

chip on chip; LVDS; multichip module; signal integrity;

D O I：

10.1109/6040.938298

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper introduces a cost effective multichip, module (MCM) for video graphic acceleration (VGA) of portable computers. A 1.7 million gate graphic processor IC and two 8 M byte DRAM chips have been integrated into a 31 X 31 mull 4-layer PBGA. Signal Integrity measurement and analysis has been performed to optimize performance of the present design and a direction for improvement for the next generation product. This study confirms that more consideration given to the MCM application at the IC design stage will maximize MCM performance.

引用

页码：309 / 316

页数：8

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