Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization

被引：9

作者：

Shao, TL ^{[1
]}

Lin, KC ^{[1
]}

Chen, C ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 11期

关键词：

electromigration; lead-free solder; Sn95/Sb5; flip chip; failure; intermetallic compound;

D O I：

10.1007/s11664-003-0023-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The electromigration-induced failure of Sn95/Sb5 flip chip solder bumps was investigated. The failure of the joints was found at the cathode/chip side after current stressing with a density of 1 X 10(4) A/cm(2) at 150degreesC for 13 sec. The growth of intermetallic compounds (IMCs) was observed at the anode side after current stressing. Voids were found near the current crowding area in the cathode/chip side, and the (Cu,Ni)(6)Sn-5 IMC at the cathode/chip end was transformed into the Sn phase. The failure mechanism for Sn95/Sb5 flip chip solder joint is proposed in this paper.

引用

页码：1278 / 1283

页数：6

共 14 条

[1]

BRANDENBURG S, 1998, P SURF MOUNT INT C E, P337

[2] Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallizaton [J].

Choi, WJ ;

Yeh, ECC ;

Tu, KN .

52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, :1201-1205

[3]

Christou A., 1994, ELECTROMIGRATION ELE

[4] Calculation of the electromigration wind force in Al alloys [J].

Dekker, JP ;

Gumbsch, P ;

Arzt, E ;

Lodder, A .

PHYSICAL REVIEW B, 1999, 59 (11) :7451-7457

[5]

FIELDS RJ, 1992, METAL SCI JOINING, P165

[6] Electromigration in eutectic SnPb solder lines [J].

Huynh, QT ;

Liu, CY ;

Chen, C ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (08) :4332-4335

[7] UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration [J].

Jang, SY ;

Wolf, J ;

Kwong, WS ;

Paik, KW .

52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, :1213-1220

[8] Electromigration of eutectic SnPb solder interconnects for flip chip technology [J].

Lee, TY ;

Tu, KN ;

Kuo, SM ;

Frear, DR .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (06) :3189-3194

[9] Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization [J].

Lee, TY ;

Tu, KN ;

Frear, DR .

JOURNAL OF APPLIED PHYSICS, 2001, 90 (09) :4502-4508

[10]

Lide D R, 1992, HDB CHEM PHYS

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