共 11 条
[1]
Baliga B.J, 1992, MODERN POWER DEVICES, P263
[4]
Double-sided cooling for high power IGBT modules using flip chip technology
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2001, 24 (04)
:698-704
[5]
A 600V 200A low loss high current density trench IGBT for hybrid vehicles
[J].
ISPSD'01: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS,
2001,
:449-452
[6]
Ishiko M., 2004, TECH J RD REV, V39, P1
[7]
Kawahashi A, 2004, ISPSD '04: PROCEEDINGS OF THE 16TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, P23
[9]
Advanced thin wafer IGBTs with new thermal management solution
[J].
ISPSD'03: 2003 IEEE 15TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS PROCEEDINGS,
2003,
:144-147
[10]

