Fluidic interconnects for modular assembly of chemical microsystems

A new assembly technology is presented which enables the modular interconnection, assembly and packaging of individual microfabricated components and/or modules (e.g., pumps, valves, reaction chambers, control circuitry, etc.). This technology can be used to make compression seal fittings utilizing self-aligning, interlocking, mechanical bonding structures and photo-patternable silicons O-ring seals. Two distinct types of fluidic interconnects for microfluidic system assembly are demonstrated using this technology. The first type demonstrates a means of interconnecting multiple, vertically stacked layers of micromachined channels. The second type demonstrates a means of connecting micromachined channels to tubing or other micromachined channels within the same plane. An important feature of these interconnects are that they are reversible, i.e., interconnections can be repeatedly made with the same structures allowing flexible system assembly. (C) 1998 Elsevier Science S.A. All rights reserved.