Novel hydrostatic pressuring mechanism for soft UV-imprinting processes

被引:10
作者
Cheng, Fang-Sung [1 ]
Yang, Sen-Yeu [1 ]
Chen, Chien-Chang [2 ]
机构
[1] Natl Taiwan Univ, Dept Mech Engn, Grace Lab Polymer Processing, Taipei 106, Taiwan
[2] Dahan Inst Technol, Dept Mech Engn, Haulien 106, Taiwan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2008年 / 26卷 / 01期
关键词
D O I
10.1116/1.2825170
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
This article reports a novel hydrostatic pressure mechanism for soft UV imprinting. With this mechanism, the pressure distribution over the whole substrate is uniform. In addition, the nonuniform deformation of the soft mold during the imprinting process can be avoided. The mechanism employs a gasbag inside a closed chamber, which upon inflation compresses the whole polydimethylsiloxane (PDMS) mold/substrate stack not only from the surface but also from all the sides. The microstructures on the PDMS mold are then replicated onto photoresist-coated substrates. The result shows that the soft UV imprinting using a hydrostatic pressure mechanism can provide uniform pressure for imprinting. It also provides the hydrostatic pressure state on the stack so that micropatterns can be replicated with high fidelity from soft mold to photoresist on substrates. The accuracy of replication, even at the edge, has been experimentally verified. (c) 2008 American Vacuum Society.
引用
收藏
页码:132 / 136
页数:5
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