Thermomigration induced degradation in solder alloys

被引：37

作者：

Basaran, Cemal ^{[1
]}

Li, Shidong ^{[1
]}

Abdulhamid, Mohd F. ^{[1
]}

机构：

[1] SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2008年 / 103卷 / 12期

关键词：

D O I：

10.1063/1.2943261

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diffusion model is introduced to study the thermomigration induced strength degradation. A nonlinear viscoplastic material model with kinematic and isotropic hardening features is utilized. The model takes into account microstructural evolution of the material. A grain coarsening capability is built into the model to study its influence on thermomigration in solder alloys. The model is validated by comparing the simulation results with experimental data. (c) 2008 American Institute of Physics.

引用

页数：9

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