Exploration of power device reliability using compact device models and fast electrothermal simulation

被引：100

作者：

Bryant, Angus T. ^{[1
]}

Mawby, Philip A. ^{[1
]}

Palmer, Patrick R. ^{[2
]}

Santi, Enrico ^{[3
]}

Hudgins, Jerry L. ^{[4
]}

机构：

[1] Univ Warwick, Sch Engn, Coventry CV4 7AL, W Midlands, England

[2] Univ Cambridge, Dept Engn, Ctr Adv Photon & Elect, Cambridge CB3 0FA, England

[3] Univ S Carolina, Dept Elect Engn, Columbia, SC 29208 USA

[4] Univ Nebraska, Dept Elect Engn, Lincoln, NE 68588 USA

来源：

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS | 2008年 / 44卷 / 03期

关键词：

compact modeling; electrothermal simulation; mission profile; power semiconductor devices; rainflow cycle counting; reliability; thermal cycling;

D O I：

10.1109/TIA.2008.921388

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the application of compact insulated gate bipolar transistor and p-i-n diode models, including features such as local lifetime control and field-stop technology, to the full electrothermal system simulation of a hybrid electric vehicle converter using a lookup table of device losses. The vehicle converter is simulated with an urban driving cycle (the Federal Urban Driving Schedule), which is used to generate transient device temperature profiles. A methodology is also described to explore the converter reliability using the temperature profile, with rainflow cycle counting techniques from material fatigue analysis. The effects of ambient temperature, driving style, and converter design on converter reliability are also investigated.

引用

页码：894 / 903

页数：10

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