Improved vapor-phase deposition technique for anti-stiction monolayers

被引:6
作者
Ashurst, R [1 ]
Carraro, C [1 ]
Chinn, JD [1 ]
Fuentes, V [1 ]
Kobrin, B [1 ]
Maboudian, R [1 ]
Nowak, R [1 ]
Yi, R [1 ]
机构
[1] Univ Calif Berkeley, Dept Chem Engn, Berkeley, CA 94720 USA
来源
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY IX | 2004年 / 5342卷
关键词
MEMS; thin films; vapor deposition; self-assembled monolayers (SAM); stiction;
D O I
10.1117/12.531798
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have developed an improved vapor-phase deposition method and an apparatus for the wafer-scale coating of monolayer films typically used in anti-stiction applications. The method consists of a surface preparation step using an O-2 plasma followed by the tunable deposition of a monolayer film in the same reactor. This process has been successfully applied to MEMS test structures and has demonstrated superior anti-stiction performance. The deposition process allows tuning of the film properties by the precise metering of the precursor and a catalyst as part of the process control scheme. The anti-stiction monolayer film deposited from dimethyldichlorosilane (DDMS), tridecafluoro-1,1,2,2-tetrahydrooctyltrichlorosilane (FOTS), and heptadecafluoro-1.1,2,2-tetrahydrodecyltrichlorosilane (FDTS) were characterized using contact angle analysis, atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The coefficient of static friction was measured using a sidewall test device and the work of adhesion using a cantilever beam array. The results showed that excellent quality, uniformity, and reproducibility could be achieved across a whole wafer using this method and equipment.
引用
收藏
页码:204 / 211
页数:8
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