Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging

被引：97

作者：

Ahat, S ^{[1
]}

Sheng, M ^{[1
]}

Luo, L ^{[1
]}

机构：

[1] DaimlerChrysler SIM Technol Co Ltd, Shanghai 200050, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2001年 / 30卷 / 10期

关键词：

SnAg solder; intermetallics; surface mount technology (SMT); aging;

D O I：

10.1007/s11664-001-0118-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effect of aging at 150 degreesC on the microstructure and shear strength of SnAg/Cu surface mount solder joint has been investigated with comparison to 62Sn36Pb2Ag/Cu. It is found that the diffusion coefficient of intermetallic compounds at SnAg/Cu interface is smaller than that of intermetallic compounds at SnPbAg/Cu interface at 150 degrees. The shear strength of SnAg solder joint is higher and decreases at a smaller rate during aging compared to that of SnPbAg solder joint. The fracture surface analysis shows that as the aging time increases, the fracture takes place along the solder/Cu6Sn5 interface with an extension toward the Sn-Cu intermetallic layer.

引用

页码：1317 / 1322

页数：6

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