Re-usable quick-release interconnect for characterization of microfluidic systems

In this work, we present a simple method for establishing re-usable quick-release compression-based fluidic connections for characterization of microfluidic systems. Our interconnect scheme uses O-rings to form a compression seal against the upper surface of the microfluidic device and around the inlet/outlet tubing, thus establishing connections to the macroworld and preventing any leaks at the ports. With this approach, fabrication is inexpensive and easy, not requiring time-consuming or specialized fabrication procedures. The connections to the real world can be established and removed numerous times without damaging the microfluidic device, and since the approach is adhesive-free there is no danger of microchannel blockage. The demonstrated interconnect is also flexible enough to permit tube bending parallel to the device and makes it possible to place input ports close together to minimize dimensions of complex microfluidic systems. In leakage tests, the interconnect was measured to withstand pressures up to 1.7 MPa, which is enough for most microfluidic applications, and probably nanofluidic applications. This interconnect makes connecting inlets and outlets faster and easier, saving hours of processing time. It can be quickly and easily reconfigured to match device port positions, and is compatible with microfluidic systems fabricated in polymer, plastic, glass or silicon. Further, the flexible nature of the developed compression-based interconnect, both with regard to tubing flexibility and the ability to re-use numerous times, makes it ideal for rapid prototyping of research systems and potentially for quality control in large-scale production.