The fabrication of polymer high aspect ratio structures with hot embossing for microfluidic applications

被引：12

作者：

Becker, H ^{[1
]}

Heim, U ^{[1
]}

Rötting, O ^{[1
]}

机构：

[1] Jenopt Mikrotech GMBH, D-07745 Jena, Germany

来源：

MICROFLUIDIC DEVICES AND SYSTEMS II | 1999年 / 3877卷

关键词：

polymer microfabrication; hot embossing; microfluidics;

D O I：

10.1117/12.359323

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In this paper we present the fabrication technologies necessary for the high volume production of microfluidic devices, with specific emphasis on the hot embossing process and the parameters necessary for achieving high aspect ratio structures on substrates like polymethylmetacrylate (PMMA) or polycarbonate (PC). In addition to the replication technology, we have investigated subsequent process steps like via hole drilling, bonding and dicing. Several examples for different microfluidic applications will be given.

引用

页码：74 / 79

页数：6

共 15 条

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ARNOLD DW, P MICR TAS 98 BANFF, P435

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