A chip removal facility for indium bump bonded pixel detectors

被引：4

作者：

Airoldi, A

Alimonti, G

Amati, M

Andreazza, A

Bulgheroni, A

Caccia, M

Giugni, D

Kucewicz, W

Lari, T

Meroni, C

Ragusa, F

Troncon, C

Vegni, G

机构：

[1] Univ Milan, Ist Nazl Fis Nucl, I-20133 Milan, Italy

[2] Univ Insubria, Como, Italy

[3] Univ Min & Met Krakow, Krakow, Poland

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2005年 / 540卷 / 2-3期

关键词：

stripping; indium bump; pixel detector;

D O I：

10.1016/j.nima.2004.11.042

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Yield maximization in multichip hybrid pixel sensors is a crucial issue in large volume productions planned for future High-Energy Physics experiments. Bump bonding process optimization can guarantee statistical single bump failure rates at the acceptable level of 10-100 ppm; nevertheless, systematic effects connected to process repeatability can affect the functionality of a full chip in a module to a much larger extent. Because of this, the reversibility of the bonding procedure has been investigated. A feasibility study on single chip assemblies for the ATLAS experiment has been successfully completed, proving the possibility of reworking. As a result of it, a dedicated facility has been conceptually designed, engineered and commissioned. The characteristics of the facility in terms of motion, temperature and tensile strength control are outlined, together with the main results. (c) 2004 Elsevier B.V. All rights reserved.

引用

页码：259 / 265

页数：7

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