The challenge of hybridization

被引：7

作者：

Caccia, M ^{[1
]}

机构：

[1] Univ Studi Insurbria, I-22100 Como, Italy

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2001年 / 465卷 / 01期

关键词：

hybridization; bump bonding; silicon detector; pixel;

D O I：

10.1016/S0168-9002(01)00389-8

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology and eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：195 / 199

页数：5

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