Triple junction and grain boundary character distributions in metallic materials

Triple junction and grain boundary orientations were obtained by electron backscattered diffraction in high purity aluminium and copper, and in copper-bismuth alloys, and were then characterized using the CSL, CAD and I-line (O-lattice) geometrical models. A computer simulation was also performed and compared to the experimental results. Relationships were established between triple junction and grain boundary character distributions using both experimental and computer simulated results. A general trend was observed which shows an increase in special triple junction character density with increasing special grain boundary character content. An increased frequency of low angle and twin boundaries is shown to lead to an increase in the I-line triple junction density. (C) 1997 Acta Metallurgica Inc.