Multiple scattering among vias in lossy planar waveguides using SMCG method

被引：23

作者：

Huang, CC ^{[1
]}

Tsang, L

Chan, CH

机构：

[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA

[2] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2002年 / 25卷 / 02期

关键词：

O(N log n); skin effects; SMCG; via;

D O I：

10.1109/TADVP.2002.803262

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Large-scale full-wave multiple scattering among cylindrical vias in planar waveguides is modeled using the Foldy-Lax equation. The formulation includes the skin effects of the conducting power/ground plane. Numerical solution of the Foldy-Lax equation with large number of unknowns is computed efficiently using the sparse-matrix canonical-grid method. In this method, interactions among vias are decomposed into the strong interactions part and the weak interactions part. The calculation of the weak part is carried out using two-dimensional (2-D)-fast Fourier transform (FFT) by translating the locations of the vias onto the uniform grids. The final solution of the Foldy-Lax equations is calculated by an iterative method. The results show O (N log N) CPU efficiency and O (N) memory efficiency. This makes large scale via problems possible for computer simulation.

引用

页码：181 / 188

页数：8

共 21 条

[1]

A SPARSE-MATRIX CANONICAL-GRID METHOD FOR SCATTERING BY MANY SCATTERERS [J].

CHAN, CH ;

TSANG, L .

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 1995, 8 (02) :114-118

[2]

Chan CH, 1997, IEICE T ELECTRON, VE80C, P1354

[3]

A fast algorithm for particle simulations (Reprinted from the Journal of Computational Physics, vol 73, pg 325-348, 1987) [J].

Greengard, L ;

Rokhlin, V .

JOURNAL OF COMPUTATIONAL PHYSICS, 1997, 135 (02) :280-292

[4]

COUPLED NOISE-ANALYSIS FOR ADJACENT VIAS IN MULTILAYERED DIGITAL CIRCUITS [J].

GU, QZ ;

TASSOUDJI, MA ;

POH, SY ;

SHIN, RT ;

KONG, JA .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS, 1994, 41 (12) :796-804

[5]

MODELING AND ANALYSIS OF VIAS IN MULTILAYERED INTEGRATED-CIRCUITS [J].

GU, QZ ;

YANG, YE ;

TASSOUDJI, MA .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1993, 41 (02) :206-214

[6]

FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA IN MULTILAYERED PACKAGING [J].

HSU, SG ;

WU, RB .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (05) :1073-1081

[7]

HSU SG, 1994, IEEE T MICROW THEORY, V42, P1540

[8]

HUANG C, 2001, P 10 TOP M EL PERF E, P161

[9]

PREDICTION OF THE EXCESS CAPACITANCE OF A VIA-HOLE THROUGH A MULTILAYERED BOARD INCLUDING THE EFFECT OF CONNECTING MICROSTRIPS OR STRIPLINES [J].

KOK, PA ;

DEZUTTER, D .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1994, 42 (12) :2270-2276

[10]

ISCALAR MAGNETOSTATIC POTENTIAL APPROACH TO THE PREDICTION OF THE EXCESS INDUCTANCE OF GROUNDED VIAS AND VIAS THROUGH A HOLE IN A GROUND PLANE [J].

KOK, PA ;

DEZUTTER, D .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1994, 42 (07) :1229-1237

← 1 2 3 →