Development of AFM-based techniques to measure mechanical properties of nanoscale structures

被引:180
作者
Sundararajan, S
Bhushan, B
机构
[1] Ohio State Univ, Nanotribol Lab Informat Storage, Columbus, OH 43210 USA
[2] Ohio State Univ, MEMS, NEMS, Columbus, OH 43210 USA
基金
美国国家科学基金会;
关键词
nanomechanics; atomic force microscope; silicon; SiO2; elastic modulus; bending strength; fracture toughness; fatigue;
D O I
10.1016/S0924-4247(02)00268-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
Mechanical property evaluation of nanometer-sized structures is necessary to help design reliable MEMS/NEMS devices. Most material properties are known to exhibit dependence on specimen size and such properties of nanoscale structures are not well characterized. Silicon and SiO2 nanometer-scale beams (nanobeams) with a 6 gm length and widths ranging from 200 to 600 nm were fabricated using lithography-based techniques. A quasi-static bending test technique for these nanobeams was developed using an atomic force microscope (AFM). This technique was used to evaluate elastic modulus, bending strength and estimate fracture toughness of the beams and beam materials. The beams failed in a linear elastic and brittle manner. Results indicate that elastic modulus and fracture toughness values are comparable to bulk values, whereas bending strength appears to be much higher for these nanobeams than for larger scale specimens, thus revealing a size effect. We also report results from monotonic cyclic loading tests of the nanobeams that reveal nanoscale fatigue performance of the beam materials. SEM observations of the fracture surfaces suggest cleavage as the fracture mechanism for both Si and SiO2 beams. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:338 / 351
页数:14
相关论文
共 33 条
[1]
[Anonymous], 1994, WEIBULL ANAL
[2]
The fracture toughness of polysilicon microdevices: A first report [J].
Ballarini, R ;
Mullen, RL ;
Yin, Y ;
Kahn, H ;
Stemmer, S ;
Heuer, AH .
JOURNAL OF MATERIALS RESEARCH, 1997, 12 (04) :915-922
[3]
Bhushan B., 1991, Handbook of tribology: materials, coatings, and surface treatments
[4]
BHUSHAN B, 1999, HDB MICRO NANOTRIBOL
[5]
BHUSHAN B, 1993, ADV INFO STORAGE SYS, V5, P211
[6]
Measurement of mechanical resonance and losses in nanometer scale silicon wires [J].
Carr, DW ;
Evoy, S ;
Sekaric, L ;
Craighead, HG ;
Parpia, JM .
APPLIED PHYSICS LETTERS, 1999, 75 (07) :920-922
[7]
MICROMECHANICAL FATIGUE TESTING [J].
CONNALLY, JA ;
BROWN, SB .
EXPERIMENTAL MECHANICS, 1993, 33 (02) :81-90
[8]
MICROMECHANICAL FRACTURE STRENGTH OF SILICON [J].
ERICSON, F ;
SCHWEITZ, JA .
JOURNAL OF APPLIED PHYSICS, 1990, 68 (11) :5840-5844
[9]
Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon [J].
Fitzgerald, AM ;
Dauskardt, RH ;
Kenny, TW .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 83 (1-3) :194-199
[10]
Mechanical characterization of thick polysilicon films:: Young's modulus and fracture strength evaluated with microstructures [J].
Greek, S ;
Ericson, F ;
Johansson, S ;
Fürtsch, M ;
Rump, A .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1999, 9 (03) :245-251