Microtensile bond strength tests: scanning electron microscopy evaluation of sample integrity before testing

被引:51
作者
Ferrari, M
Goracci, C
Sadek, F
Cardoso, PEC
机构
[1] Univ Sienna, Dept Dent Mat, Siena, Italy
[2] Univ Sao Paulo, Dept Dent Mat, Sao Paulo, Brazil
关键词
dental materials; scanning electron microscopy; bond strength; dentin bonding agents;
D O I
10.1034/j.1600-0722.2002.21317.x
中图分类号
R78 [口腔科学];
学科分类号
1003 [口腔医学];
摘要
The failure of a certain number of microtensile specimens during their preparation and before loading is a common and undesirable occurrence. This study was aimed at observing, under a scanning electron microscope, enamel and dentin microtensile specimens, in order to find structural faults that might be responsible for their premature failure. In a sample of 80 sticks, none of the specimens was found to be free of defects. These may consist of microcracks in enamel, most often at the periphery of the stick, or in dentin at the level of hybrid layer. Gaps were often seen at the interfaces between the substrates. Voids were sometimes visible within the resin composite thickness. Enamel specimens tended to exhibit more defects than dentin specimens. It is fair to suspect that, because of the brittleness of the tissue, enamel microtensile specimens are intrinsically more prone to failure, thus yielding bond strengths which are not significantly higher than those measured on dentin specimens. This leads one to question the reliability of the microtensile method for testing adhesion on enamel. It seems sensible to develop a method for a quantitative assessment of specimens integrity before loading as a possible predictor for their performance under load.
引用
收藏
页码:385 / 391
页数:7
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