Stress focusing for controlled fracture in microelectromechanical systems

被引：30

作者：

Meitl, Matthew A.

Feng, Xue

Dong, Jingyan

Menard, Etienne

Ferreira, Placid M.

Huang, Yonggang

Rogers, John A.

机构：

[1] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

[2] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA

[3] Univ Illinois, Beckman Inst Adv Sci & Technol, Urbana, IL 61801 USA

[4] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

来源：

APPLIED PHYSICS LETTERS | 2007年 / 90卷 / 08期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.2679072

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This letter describes a strategy for controlling fracture in microelectromechanical systems (MEMSs) based on the control of corner sharpness. Studies of model MEMS structures with round (radius of approximately microns), intermediate, and sharp (< 10 nm) corners demonstrate the effects of corner sharpness on the concentration of applied stress. Finite-element analysis reveals that stress distributions intensify and localize as sharpness increases, and transfer printing experiments demonstrate the influence of stress concentration on breakability. (c) 2007 American Institute of Physics.

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页数：3

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共 11 条

[1] 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration [J].

Banerjee, K ;

Souri, SJ ;

Kapur, P ;

Saraswat, KC .

PROCEEDINGS OF THE IEEE, 2001, 89 (05) :602-633

[2] A new transferred ultra-thin silicon micropackaging [J].

Chen, JY ;

Huang, LS ;

Chu, CH ;

Peizen, C .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (04) :406-409

[3] Tether and joint design for micro-components used in microassembly of 3D microstructures [J].

Dechev, N ;

Cleghorn, WL ;

Mills, JK .

MEMS/MOEMS COMPONENTS AND THEIR APPLICATIONS, 2004, 5344 :134-146

[4] Microassembly of 3-D microstructures using a compliant, passive microgripper [J].

Dechev, N ;

Cleghorn, WL ;

Mills, JK .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (02) :176-189

[5] Tether- and post-enabled flip-chip assembly for manufacturable RF-MEMS [J].

Faheem, FF ;

Lee, YC .

SENSORS AND ACTUATORS A-PHYSICAL, 2004, 114 (2-3) :486-495

[6] Bulk quantities of single-crystal silicon micro-/nanoribbons generated from bulk wafers [J].

Ko, Heung Cho ;

Baca, Alfred J. ;

Rogers, John A. .

NANO LETTERS, 2006, 6 (10) :2318-2324

[7] Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates [J].

Lee, KJ ;

Motala, MJ ;

Meitl, MA ;

Childs, WR ;

Menard, E ;

Shim, AK ;

Rogers, JA ;

Nuzzo, RG .

ADVANCED MATERIALS, 2005, 17 (19) :2332-+

[8] Mechanically flexible thin-film transistors that use ultrathin ribbons of silicon derived from bulk wafers [J].

Mack, S. ;

Meitl, M. A. ;

Baca, A. J. ;

Zhu, Z. -T. ;

Rogers, J. A. .

APPLIED PHYSICS LETTERS, 2006, 88 (21)

[9] Transfer printing by kinetic control of adhesion to an elastomeric stamp [J].

Meitl, MA ;

Zhu, ZT ;

Kumar, V ;

Lee, KJ ;

Feng, X ;

Huang, YY ;

Adesida, I ;

Nuzzo, RG ;

Rogers, JA .

NATURE MATERIALS, 2006, 5 (01) :33-38

[10] Batch transfer of microstructures using flip-chip solder bonding [J].

Singh, A ;

Horsley, DA ;

Cohn, MB ;

Pisano, AP ;

Howe, RT .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1999, 8 (01) :27-33