Laser-induced site-selective silver seeding on polyimide for electroless copper plating

被引：78

作者：

Chen, Dongsheng ^{[1
]}

Lu, Qinghua ^{[1
]}

Zhao, Yan ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Chem & Chem Technol, Res Inst Polymer, Shanghai 200240, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2006年 / 253卷 / 03期

基金：

中国国家自然科学基金;

关键词：

electroless plating; ion exchange; laser; lithography; polyimide; silver;

D O I：

10.1016/j.apsusc.2006.02.039

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Ag particles were generated on Ag+-doped polyimide film by laser direct writing, followed by selective copper deposition using the metallic silver particles as seeds. Laser irradiation caused in situ reduction and agglomeration of silver on the polyimide film. The copper lines were less uniform and compact with higher scanning velocity and the width of the deposited copper line could reach 25 mu m. Equations of the relationship between scanning velocity and connectivity of the deposited copper patterns have been derived. The process was characterised by AFM, XPS, SEM, and semiconductor characterisation system. (c) 2006 Elsevier B.V.. All rights reserved.

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收藏

页码：1573 / 1580

页数：8

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