HBT power devices and circuits

被引:10
作者
Bayraktaroglu, B
机构
[1] Northrop Grumman Corporation, MS 3K13, Baltimore, MD 21203
关键词
D O I
10.1016/S0038-1101(97)00120-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The status of the power HBT technology is reviewed. The advances made in the electrical and thermal design of unit-cells are examined to identify the present and near future applications in microwave power amplifications. The current status of the technology is such that AlGaGs/GaAs HBTs have become suitable for most microwave and especially for commercial LiS-band frequency applications. The performance is not yet adequate for mm-wave applications, which may require alternative material technologies. (C) 1997 Elsevier Science Ltd.
引用
收藏
页码:1657 / 1665
页数:9
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