A resume-standby application processor for 3G cellular phones

被引：21

作者：

Kamei, T ^{[1
]}

Ishikawa, M ^{[1
]}

Hiraoka, T ^{[1
]}

Irita, T ^{[1
]}

Abe, M ^{[1
]}

Saito, Y ^{[1
]}

Tawara, Y ^{[1
]}

Ide, H ^{[1
]}

Furuyama, M ^{[1
]}

Tamaki, S ^{[1
]}

Yasu, Y ^{[1
]}

Shimazaki, Y ^{[1
]}

Yamaoka, M ^{[1
]}

Mizuno, H ^{[1
]}

Irie, N ^{[1
]}

Nishii, O ^{[1
]}

Arakawa, F ^{[1
]}

Hirose, K ^{[1
]}

Yoshioka, S ^{[1
]}

Hattori, T ^{[1
]}

机构：

[1] Renesas Technol, Tokyo, Japan

来源：

2004 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS | 2004年 / 47卷

关键词：

D O I：

10.1109/ISSCC.2004.1332731

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：336 / 337

页数：2

共 4 条

[1] An embedded processor core for consumer appliances with 2.8GFLOPS and 36M polygons/s FPU [J].

Arakawa, F ;

Yoshinaga, T ;

Hayashi, T ;

Kiyoshige, Y ;

Okada, T ;

Nishibori, M ;

Hiraoka, T ;

Ozawa, M ;

Kodama, T ;

Irita, T ;

Kamei, T ;

Ishikawa, M ;

Nitta, Y ;

Nishii, O ;

Hattori, T .

2004 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 2004, 47 :334-335

[2] μI/O architecture for 0.13-μm wide-voltage-range system-on-a-package (SoP) designs [J].

Kanno, Y ;

Mizuno, H ;

Oodaira, N ;

Yasu, Y ;

Yanagisawa, K .

2002 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2002, :168-169

[3]

YAMADA T, 2002, ISSCC, P370

[4] A 300MHz 25μA/Mb leakage on-chip SRAM module featuring process-variation immunity and low-leakage-active mode for mobile-phone application processor [J].

Yamaoka, M ;

Shinozaki, Y ;

Maeda, N ;

Shimazaki, Y ;

Kato, K ;

Shimada, S ;

Yanagisawa, K ;

Osada, K .

2004 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 2004, 47 :494-495

← 1 →