Three-dimensional pattern transfer and nanolithography: modified soft molding

被引：32

作者：

Kim, YS ^{[1
]}

Park, J

Lee, HH

机构：

[1] Seoul Natl Univ, Sch Chem Engn, Seoul 151744, South Korea

[2] Seoul Natl Univ, Nanoelect Inst, Seoul 151744, South Korea

来源：

APPLIED PHYSICS LETTERS | 2002年 / 81卷 / 06期

关键词：

D O I：

10.1063/1.1498149

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

One-step transfer of molded three-dimensional polymer structures into underlying substrate is reported. The one-step transfer is made possible by a molding technique presented here in the form of modified soft molding. Formation of a desired three-dimensional structure in a polymer film by this method, followed by one-step reactive ion etching, is utilized for the transfer. The technique is also shown to be effective in transferring sub-100-nm features. (C) 2002 American Institute of Physics.

引用

页码：1011 / 1013

页数：3

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