Evaluation of lead-free soldering for automotive applications.

被引：2

作者：

Guédon, A ^{[1
]}

Woirgard, E ^{[1
]}

Zardini, C ^{[1
]}

机构：

[1] Univ Bordeaux 1, CNRS UMR 5818, ENSEIRB, Lab IXL, F-33405 Talence, France

来源：

MICROELECTRONICS RELIABILITY | 2002年 / 42卷 / 9-11期

关键词：

D O I：

10.1016/S0026-2714(02)00189-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Studies have been conducted worldwide in order to find solder alloys able to replace the conventional SnPb eutectic. The SnAgCu eutectic seems to be one of the best candidates. However, during a transition period lead-containing and lead-free component finishes will be mounted with lead-free solder paste on the same board. So, components with three different finishes (tin-lead, pure tin and gold) were mounted on high T, epoxy-glass PCB using a specially designed SnAg4Cu0.5 solder paste. Cross-sections were made on as reflowed and aged (-25degreesC/+150degreesC thermal cycles, 2095 hours spent at 150degreesC) solder joints in order to observe their microstructure and analyse the interfaces. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：1555 / 1558

页数：4

共 5 条

[1]

BLOOMER TE, 1999, THESIS IOWA STATE U

[2]

MARTIN GM, 2001, P EL SYST VEH BAD BA, P729

[3]

SUMMERS TS, 1991, THESIS U CALIFORNIA

[4] Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies [J].

Vianco, P ;

Rejent, J ;

Artaki, I ;

Ray, U ;

Finley, D ;

Jackson, A .

46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, :1172-1183

[5] The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT [J].

Zhu, QN ;

Sheng, M ;

Luo, L .

SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 12 (03) :19-23

← 1 →