The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

被引：32

作者：

Zhu, QN ^{[1
]}

Sheng, M ^{[1
]}

Luo, L ^{[1
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Met, SIM DaimlerChrysler Lab, Shanghai, Peoples R China

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2000年 / 12卷 / 03期

关键词：

lead-free soldering; contamination; surface mount technology; microstructures;

D O I：

10.1108/09540910010347854

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of Pb contamination on the microstructure and shear strength of lead-free solder joints with non-lead containing finishes on both the PCB and terminals of 1,206 chip capacitors at different temperatures were investigated. Two kinds of lead-free solders (Sn95.5Ag3.5 and Sn95Sb5) were selected, and different amounts of eutectic Sn-Pb were added to these lead-free solders according to the potential Pb contamination in a 1,206 chip capacitor solder joint. It was found that there was no difference in shear strength of solder joint at room temperature for those with or without Ph contamination, but the shear strength at 125 degreesC for the solder joint without Pb contamination was about 15 percent higher than fur those with Fb contamination.

引用

页码：19 / 23

页数：5

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