Metallic alloy coatings using coaxial vacuum arc deposition

被引：4

作者：

Chun, SY ^{[1
]}

Chayahara, A ^{[1
]}

Horino, Y ^{[1
]}

机构：

[1] AIST, Osaka Natl Res Inst, Dept Phys Mat, Ikeda 5638577, Japan

来源：

MATERIALS TRANSACTIONS JIM | 2000年 / 41卷 / 01期

关键词：

vacuum arc discharge; thin films; metal plasma; titanium aluminide; Rutherford backscattering; microstructure;

D O I：

10.2320/matertrans1989.41.44

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

A new film fabrication method for metallic alloy has been established using coaxial vacuum are deposition (CVAD). In our vacuum are system, because the plasma, on the surface of the evaporation source (target) can be controlled by pulsed are discharge, it is possible to fabricate the films with same compositions as the target and to control the thickness of the Ti-Al film at a nanometer scale. In this report, crystallographic results of the Ti-Al films resulting from changing the substrate and after the heat-treatment is demonstrated.

引用

页码：44 / 46

页数：3

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