New synthetic route for photosensitive poly(benzoxazole)

被引:21
作者
Ebara, K [1 ]
Shibasaki, Y [1 ]
Ueda, M [1 ]
机构
[1] Tokyo Inst Technol, Dept Organ & Polymer Mat, Meguro Ku, Tokyo 1528552, Japan
关键词
high temperature materials; imaging; photolithography; poly(benzoxazole); photosensitive compound; photoresists;
D O I
10.1002/pola.10432
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A new positive working photosensitive poly(benzoxazole) (PBO) precursor based on poly(o-hydroxyazomethine) (3) and 1-{1,1-bis[4-(2-diazo-l-(2H)naphthalenone- 5-sulfonyloxy)phenyl]ethyl)-4-{1-[4- (2-diazo-1(2H)naphthalenone-5-sulfonyloxy)phenyl] methylethyl]benzene (S-DNQ) as a photosensitive compound was developed. 3 was prepared by the condensation of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane with isophthalaldehyde in 1-methyl-2-pyrrolidinone/toluene under azeotropic conditions. The photosensitive PBO precursor containing 30 wt % S-DNQ showed a sensitivity of 120 mJ cm(-2) and a contrast of 2.2 when it was exposed to 436-nm light and developed with a 2.38 wt % aqueous tetramethylammonium hydroxide solution at room temperature. A fine positive image featuring 10-mum line and space patterns was observed on the film of the photoresist exposed to 200 mJ cm(-1) ultraviolet light at 436 nm by the contact mode. The positive image was successfully converted into the PBO pattern by a thermal treatment. (C) 2002 Wiley Periodicals, Inc.
引用
收藏
页码:3399 / 3405
页数:7
相关论文
共 18 条
[1]   Photopatternable insulating materials [J].
Ahne, H ;
Rubner, R ;
Sezi, R .
APPLIED SURFACE SCIENCE, 1996, 106 :311-315
[2]  
AHNE H, 1905, Patent No. 4395482
[3]  
AHNE H, 1980, Patent No. 0023626
[4]  
AHNE H, 1989, P POLYM MAT SCI ENG, V60, P629
[5]  
Banba T., 1991, P EL COMP C IEEE, P564
[6]  
Ebara K., 2001, Journal of Photopolymer Science and Technology, V14, P55, DOI 10.2494/photopolymer.14.55
[7]   SYNTHESIS AND PROPERTIES OF HIGHLY FLUORINATED POLYIMIDES [J].
HOUGHAM, G ;
TESORO, G ;
SHAW, J .
MACROMOLECULES, 1994, 27 (13) :3642-3649
[8]   Positive-tone wafer coating materials evaluation on lithography process [J].
Huang, DF ;
Chiou, JY ;
Hung, CC ;
Young, BR .
INTEGRATED OPTICS DEVICES V, 2001, 4277 :375-380
[9]   NEW HIGH-TEMPERATURE STABLE POSITIVE PHOTORESISTS BASED ON HYDROXY POLYIMIDES AND POLYAMIDES CONTAINING THE HEXAFLUOROISOPROPYLIDENE (6-F) LINKING GROUP [J].
KHANNA, DN ;
MUELLER, WH .
POLYMER ENGINEERING AND SCIENCE, 1989, 29 (14) :954-959
[10]  
KHANNA DN, 1990, POLYM PREPR AM CHEM, V1, P348