Micromachined flat-walled valveless diffuser pumps

被引：168

作者：

Olsson, A

Enoksson, P

Stemme, G

Stemme, E

机构：

[1] Dept. of Signals, Sensors, and Syst., Royal Institute of Technology

[2] Royal Institute of Technology, Stockholm

[3] Grp. Res. on Sensors and Actuators, Dept. of Signals, Sensors, and Syst., Royal Institute of Technology

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 1997年 / 6卷 / 02期

关键词：

deep reactive ion etching; diffuser; micropump; nozzle; valueless diffuser pump;

D O I：

10.1109/84.585794

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The first valveless diffuser pump fabricated using the latest technology in deep reactive ion etching (DRIE) is presented. The pump was fabricated in a two-mask micromachining process in a silicon wafer polished on both sides, anodically bonded to a glass wafer. Pump chambers and diffuser elements were etched in the silicon wafer using DRIE, while inlet and outlet holes are etched using an anisotropic etch. The DRIE etch resulted in rectangular diffuser cross sections. Results are presented on pumps with different diffuser dimensions in terms of diffuser neck width, length, and angle. The maximum pump pressure is 7.6 m H2O (74 kPa), and the maximum pump flow is 2.3 ml/min for water. [219]

引用

页码：161 / 166

页数：6

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