A very simple method of flattening Si(111) surface at an atomic level using oxygen-free water

被引:49
作者
Fukidome, H [1 ]
Matsumura, M [1 ]
机构
[1] Osaka Univ, Res Ctr Photoenerget Organ Mat, Toyonaka, Osaka 5608531, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1999年 / 38卷 / 10A期
关键词
silicon; surface; flattening; water; oxygen; ammonium sulfite; atomic force microscopy; infrared absorption spectroscopy;
D O I
10.1143/JJAP.38.L1085
中图分类号
O59 [应用物理学];
学科分类号
摘要
Si(111) surfaces were found to be very easily flattened at an atomic level by immersing the wafers in water, from which dissolved oxygen wad removed by the addition of sulfite ion as chemical deoxygenator, at room temperature. After the treatment with this oxygen-free water, the Si(lll) surfaces slightly misoriented in the [11 (2) over bar] direction showed straight and parallel steps and wide terraces under atomic force microscopy observation. When wafers slightly misoriented in the opposite direction were treated in the same manner, the steps showed a characteristic zigzag pattern with an angle of 60 degrees. The steps that appeared on both surfaces were attributable to monohydride steps generated on the edge of flat terraces.
引用
收藏
页码:L1085 / L1086
页数:2
相关论文
共 12 条
[1]   Analysis of silicon surface in connection with its unique electrochemical and etching behavior [J].
Fukidome, H ;
Ohno, T ;
Matsumura, M .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (02) :679-682
[2]   Electrochemical study of atomically flattening process of silicon in 40% NH4F solution [J].
Fukidome, H ;
Matsumura, M .
APPLIED SURFACE SCIENCE, 1998, 130 :146-150
[3]   IDEAL HYDROGEN TERMINATION OF THE SI-(111) SURFACE [J].
HIGASHI, GS ;
CHABAL, YJ ;
TRUCKS, GW ;
RAGHAVACHARI, K .
APPLIED PHYSICS LETTERS, 1990, 56 (07) :656-658
[4]  
HIGASHI GS, 1993, HDB SEMICONDUCTOR WA, P433
[5]   CHEMICAL ETCHING OF VICINAL SI(111) - DEPENDENCE OF THE SURFACE-STRUCTURE AND THE HYDROGEN TERMINATION ON THE PH OF THE ETCHING SOLUTIONS [J].
JAKOB, P ;
CHABAL, YJ .
JOURNAL OF CHEMICAL PHYSICS, 1991, 95 (04) :2897-2909
[6]   Simultaneous observation of SiO2 surface and SiO2/Si interface using self-assembled-monolayer island [J].
Komeda, T ;
Namba, K ;
Nishioka, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1998, 37 (2B) :L214-L217
[7]   Enhanced etching rate of silicon in fluoride containing solutions at pH 6.4 [J].
Matsumura, M ;
Fukidome, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1996, 143 (08) :2683-2686
[8]   ANISOTROPIC ETCHING VERSUS INTERACTION OF ATOMIC STEPS - SCANNING-TUNNELING-MICROSCOPY OBSERVATIONS ON HF/NH4F-TREATED SI(111) [J].
PIETSCH, GJ ;
KOHLER, U ;
HENZLER, M .
JOURNAL OF APPLIED PHYSICS, 1993, 73 (10) :4797-4807
[9]   Atomic force microscopy observations of Si surfaces after rinsing in ultrapure water with low dissolved oxygen concentration [J].
Usuda, K ;
Yamada, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (09) :3204-3207
[10]   THE ROLE OF DISSOLVED-OXYGEN IN HOT-WATER DURING DISSOLVING OXIDES AND TERMINATING SILICON SURFACES WITH HYDROGEN [J].
WATANABE, S ;
SUGITA, Y .
SURFACE SCIENCE, 1995, 327 (1-2) :1-8