Room temperature self-annealing of electroplated and sputtered copper films

被引：7

作者：

Chen, M ^{[1
]}

Rengarajan, S ^{[1
]}

Hey, P ^{[1
]}

Dordi, Y ^{[1
]}

Zhang, H ^{[1
]}

Hashim, I ^{[1
]}

Ding, PJ ^{[1
]}

Chin, B ^{[1
]}

机构：

[1] Appl Mat Inc, Electra Copper Program, Met Deposit Prod Business Grp, Santa Clara, CA 95054 USA

来源：

ADVANCED INTERCONNECTS AND CONTACTS | 1999年 / 564卷

关键词：

D O I：

10.1557/PROC-564-413

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Self-annealing properties of electroplated and sputtered copper films at room temperature were investigated in this study, in particular, the effect of copper film thickness, electrolyte systems used, as well as their level of organic additives for electroplating. Real-time grain growth was observed by transmission electron microscopy. Sheet resistance and X-ray diffraction measurements further confirmed the recrystallization of the electroplated copper film with time. The recrystallization of electroplated films was then compared with that of sputtered copper films.

引用

页码：413 / 420

页数：8

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