Large-scale production of nano-twinned, ultrafine-grained copper

被引：80

作者：

Hodge, A. M.

Wang, Y. M.

Barbee, T. W., Jr.

机构：

[1] Lawrence Livermore Natl Lab, Mat Sci & Technol Div, Livermore, CA 94550 USA

[2] Lawrence Livermore Natl Lab, Nanoscale Synth & Characterizat Lab, Livermore, CA 94550 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 429卷 / 1-2期

关键词：

ultrafine-grained copper; nano-twinned; multilayers; sputtering;

D O I：

10.1016/j.msea.2006.05.109

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Large-scale production of high purity (99.999%), nano-twinned, and ultrafine-grained copper foils (22 mu m thick) was successfully implemented by the use of nanoscale multilayer technology. The process allows the production of up to fourteen 10 cm diameter foils during a single deposition run with high levels of reproducibility. Mechanical tests demonstrate that the strength of the Cu foils (alpha(y) similar to 540-690 MPa) compares favorably to ultratine-grained copper samples produced by other methods. (c) 2006 Elsevier B.V. All rights reserved.

引用

收藏

页码：272 / 276

页数：5

相关论文

共 26 条

[1] The influence of texture on the elastic properties of ultrafine-grain copper [J].

Agnew, SR ;

Weertman, JR .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1998, 242 (1-2) :174-180

[2] Microstructure and mechanical behavior of nanocrystalline metals [J].

Agnew, SR ;

Elliott, BR ;

Youngdahl, CJ ;

Hemker, KJ ;

Weertman, JR .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2000, 285 (1-2) :391-396

[3]

BARBEE TW, 1985, P TOP C LOW EN XRAY, P313

[4]

BARBEE TW, 1980, P FALL M MET SOC AIM

[5] Tensile properties of in situ consolidated nanocrystalline Cu [J].

Cheng, S ;

Ma, E ;

Wang, YM ;

Kecskes, LJ ;

Youssef, KM ;

Koch, CC ;

Trociewitz, UP ;

Han, K .

ACTA MATERIALIA, 2005, 53 (05) :1521-1533

[6] COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPER [J].

DAHLGREN, SD .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04) :832-836

[7] Microstructure/mechanical properties relationship in electrodeposited Ni/Cu nanolaminates [J].

Ebrahimi, F ;

Liscano, AJ .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 301 (01) :23-34

[8] Mechanics of compressive stress evolution during thin film growth [J].

Guduru, PR ;

Chason, E ;

Freund, LB .

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2003, 51 (11-12) :2127-2148

[9] Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers [J].

Huang, HB ;

Spaepen, F .

ACTA MATERIALIA, 2000, 48 (12) :3261-3269

[10] Mechanical behavior of nanocrystalline metals and alloys [J].

Kumar, KS ;

Van Swygenhoven, H ;

Suresh, S .

ACTA MATERIALIA, 2003, 51 (19) :5743-5774