Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

被引：28

作者：

Abdulhamid, Mohd F. ^{[1
]}

Basaran, Cemal ^{[1
]}

机构：

[1] SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2009年 / 131卷 / 01期

关键词：

annealing; copper alloys; grain boundary diffusion; hardness; hardness testing; high-temperature effects; silver alloys; solders; thermal diffusion; tin alloys; INTERMETALLIC GROWTH; ELASTIC-MODULUS; EUTECTIC SNPB; MORPHOLOGY; KINETICS; CU;

D O I：

10.1115/1.3068296

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn-4Ag-0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000 degrees C/cm thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu3Sn intermetallic compound (IMC) layer, and we observed disintegration of Cu6Sn5 IMC. On the other hand, samples subjected to isothermal annealing exhibited IMC growth. In samples subjected to thermomigration, near the cold side the Cu concentration is significantly higher compared with hot side. Extensive surface hardness testing showed an increase in hardness from the hot to cold sides, which possibly indicates that Sn grain coarsening is in the same direction.

引用

页码：0110021 / 01100212

页数：12

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