Profiling nitrogen in ultrathin silicon oxynitrides with angle-resolved x-ray photoelectron spectroscopy

Angle-resolved x-ray photoelectron spectroscopy (AR-XPS) is utilized in this work to accurately and nondestructively determine the nitrogen concentration and profile in ultrathin SiOxNy films. With furnace growth at 800-850 degrees C using nitric oxide (NO) and oxygen, 10(13)-10(15) cm(-2) of nitrogen is incorporated in the ultrathin (less than or equal to 4 nm) oxide films. Additional nitrogen can be incorporated by low energy ion (N-15(2)) implantation. The nitrogen profile and nitrogen chemical bonding states are analyzed as a function of the depth to understand the distribution of nitrogen incorporation during the SiOxNy thermal growth process. AR-XPS is shown to yield accurate nitrogen profiles that agree well with both medium energy ion scattering and secondary ion mass spectrometry analysis. Preferential nitrogen accumulation near the SiOxNy/Si interface is observed with a NO annealing, and nitrogen is shown to bond to both silicon and oxygen in multiple distinct chemical states, whose thermal stability bears implications on the reliability of nitrogen containing SiO2. (C) 2000 American Institute of Physics. [S0021-8979(00)02808-5].