Examination of thermal properties by scanning thermal microscopy in ultrafine-grained pure titanium surface layer produced by surface mechanical attrition treatment

被引:21
作者
Guo, FA
Zhu, KY
Trannoy, N
Lu, J
机构
[1] Univ Reims, Unite Therm & Anal Phys, Lab Energet & Opt, F-51687 Reims 2, France
[2] Univ Technol Troyes, LASMIS, F-10010 Troyes, France
关键词
ultrafine-grained microstructure; titanium; surface mechanical attrition treatment; scanning thermal microscopy; thermal conductivity;
D O I
10.1016/j.tca.2004.02.018
中图分类号
O414.1 [热力学];
学科分类号
摘要
Ultrafine-grained pure titanium surface layer produced by surface mechanical attrition treatment (SMAT) was systematically studied by scanning thermal microscopy (SThM) that allows thermal conductivity to be mapped down to the submicrometer scale. It is found that the microstructures obtained by SMAT show different thermal conductivities that strongly depend on the grain size: the thermal conductivity of the nanostructured surface layer decreases substantially if compared with that of the coarse-grained matrix of the sample. A theoretical approach, based on this investigation, was used to calculate the heat flows from the probe tip to the sample and then estimate the thermal conductivities at different scanning locations. Experimental results and theoretical calculation demonstrate that the SThM analyses can be used as a powerful tool for the thermal property and microstructure analysis of ultrafine-grained microstructures. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:239 / 246
页数:8
相关论文
共 28 条
[1]  
[Anonymous], 1961, HDB THERMOPHYSICAL P
[2]   Application of a Wollaston wired probe for quantitative thermal analysis [J].
Buzin, AI ;
Kamasa, P ;
Pyda, M ;
Wunderlich, B .
THERMOCHIMICA ACTA, 2002, 381 (01) :9-18
[3]  
Dinwiddie R.B., 1994, Thermal Conductivity 22, V22, P668
[4]  
DORLOT JM, 1999, MATERIAUX
[5]   Thermal characterization of power devices by scanning thermal microscopy techniques [J].
Fiege, GBM ;
Niedernostheide, FJ ;
Schulze, HJ ;
Barthelmess, R ;
Balk, LJ .
MICROELECTRONICS RELIABILITY, 1999, 39 (6-7) :1149-1152
[6]   Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) [J].
Fiege, GBM ;
Feige, V ;
Phang, JCH ;
Maywald, M ;
Gorlich, S ;
Balk, LJ .
MICROELECTRONICS RELIABILITY, 1998, 38 (6-8) :957-961
[7]   Quantitative thermal conductivity measurements with nanometre resolution [J].
Fiege, GBM ;
Altes, A ;
Heiderhoff, B ;
Balk, LJ .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1999, 32 (05) :L13-L17
[8]   Electrical and thermal conductivity of discontinuously reinforced aluminum composites at sub-ambient temperatures [J].
Geiger, AL ;
Hasselman, DPH ;
Welch, P .
ACTA MATERIALIA, 1997, 45 (09) :3911-3914
[9]   NANOCRYSTALLINE MATERIALS [J].
BIRRINGER, R .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1989, 117 :33-43
[10]   DC scanning thermal microscopy: Characterisation and interpretation of the measurement [J].
Gomes, S ;
Trannoy, N ;
Grossel, P ;
Depasse, F ;
Bainier, C ;
Charraut, D .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2001, 40 (11) :949-958