Formation of silicon-oxide layers at the interface between tantalum oxide and silicon substrate

被引:33
作者
Ono, H
Koyanagi, K
机构
[1] NEC Corp Ltd, Silicon Syst Res Labs, Tsukuba, Ibaraki 3058501, Japan
[2] NEC Corp Ltd, ULSI Device Dev Labs, Kanagawa 2291198, Japan
关键词
D O I
10.1063/1.125375
中图分类号
O59 [应用物理学];
学科分类号
摘要
Silicon-oxide layers formed at the tantalum-oxide/silicon interface were investigated by using Fourier transform infrared spectroscopy (FTIR). The samples were annealed in oxygen atmosphere, in nitrogen atmosphere, and in vacuum. It has been found that the formation of the interfacial silicon-oxide layers depends neither on the tantalum-oxide thickness nor on the annealing atmosphere, but on the annealing temperature. The silicon-oxide layer is formed even by annealing in vacuum. It is concluded that the silicon-oxide layer is formed not by a diffusion of the oxygen from the annealing atmosphere, but by a reaction between the tantalum-oxide film and the Si substrate. FTIR analysis and transmission electron microscopy of the interfacial layer show that the silicon-oxide layer has a bonding configuration different from a pure silicon dioxide. (C) 1999 American Institute of Physics. [S0003-6951(99)03948-0].
引用
收藏
页码:3521 / 3523
页数:3
相关论文
共 11 条
[1]   Intermixing at the tantalum oxide/silicon interface in gate dielectric structures [J].
Alers, GB ;
Werder, DJ ;
Chabal, Y ;
Lu, HC ;
Gusev, EP ;
Garfunkel, E ;
Gustafsson, T ;
Urdahl, RS .
APPLIED PHYSICS LETTERS, 1998, 73 (11) :1517-1519
[2]   ELLIPSOMETRIC EXAMINATION OF GROWTH AND DISSOLUTION RATES OF TA2O5 FILMS FORMED BY METALORGANIC CHEMICAL VAPOR-DEPOSITION [J].
AN, CH ;
SUGIMOTO, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (07) :1956-1962
[3]   Properties of amorphous and crystalline Ta2O5 thin films deposited on Si from a Ta(OC2H5)5 precursor [J].
Chaneliere, C ;
Four, S ;
Autran, JL ;
Devine, RAB ;
Sandler, NP .
JOURNAL OF APPLIED PHYSICS, 1998, 83 (09) :4823-4829
[4]   Nondestructive measurement of interfacial SiO2 films formed during deposition and annealing of Ta2O5 [J].
Devine, RAB .
APPLIED PHYSICS LETTERS, 1996, 68 (14) :1924-1926
[5]   ULTRATHIN TANTALUM OXIDE CAPACITOR DIELECTRIC LAYERS FABRICATED USING RAPID THERMAL NITRIDATION PRIOR TO LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION [J].
KAMIYAMA, S ;
LESAICHERRE, PY ;
SUZUKI, H ;
SAKAI, A ;
NISHIYAMA, I ;
ISHITANI, A .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (06) :1617-1625
[6]   INTERFACIAL OXIDATION OF SILICON SUBSTRATES THROUGH TA2O5 FILMS [J].
KATO, T ;
ITO, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (10) :2586-2590
[7]   MICROSTRUCTURE AND ELECTRICAL-PROPERTIES OF TANTALUM OXIDE THIN-FILM PREPARED BY ELECTRON-CYCLOTRON-RESONANCE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION [J].
KIM, I ;
AHN, SD ;
CHO, BW ;
AHN, ST ;
LEE, JY ;
CHUN, JS ;
LEE, WJ .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (12A) :6691-6698
[8]   Infrared studies of transition layers at SiO2/Si interface [J].
Ono, H ;
Ikarashi, T ;
Ando, K ;
Kitano, T .
JOURNAL OF APPLIED PHYSICS, 1998, 84 (11) :6064-6069
[9]   UV-O3 AND DRY-O2 - 2-STEP ANNEALED CHEMICAL VAPOR-DEPOSITED TA2O5 FILMS FOR STORAGE DIELECTRICS OF 64-MB DRAMS [J].
SHINRIKI, H ;
NAKATA, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (03) :455-462
[10]  
Son KA, 1998, ELECTROCHEM SOLID ST, V1, P178, DOI 10.1149/1.1390677