Fracture toughness and subcritical crack growth in polycrystalline silicon

被引：84

作者：

Chasiotis, I. ^{[1
]}

Cho, S. W.

Jonnalagadda, K.

机构：

[1] Univ Illinois, Urbana, IL 61801 USA

[2] Univ Virginia, Charlottesville, VA 22904 USA

来源：

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 2006年 / 73卷 / 05期

关键词：

D O I：

10.1115/1.2172268

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

引用

页码：714 / 722

页数：9

共 37 条

[1] Fracture size effects and polycrystalline inhomogeneity [J].

Abdel-Tawab, K ;

Rodin, GJ .

INTERNATIONAL JOURNAL OF FRACTURE, 1998, 93 (1-4) :247-259

[2] ON THE RELEVANCE OF LINEAR ELASTIC FRACTURE-MECHANICS TO ICE [J].

ABDELTAWAB, K ;

RODIN, GJ .

INTERNATIONAL JOURNAL OF FRACTURE, 1993, 62 (02) :171-181

[3] The effects of heterogeneity and anisotropy on the size effect in cracked polycrystalline films [J].

Ballarini, R ;

Mullen, RL ;

Heuer, AH .

INTERNATIONAL JOURNAL OF FRACTURE, 1999, 95 (1-4) :19-39

[4] The fracture toughness of polysilicon microdevices: A first report [J].

Ballarini, R ;

Mullen, RL ;

Yin, Y ;

Kahn, H ;

Stemmer, S ;

Heuer, AH .

JOURNAL OF MATERIALS RESEARCH, 1997, 12 (04) :915-922

[5] The mechanical strength of polysilicon films: Part 2. Size effects associated with elliptical and circular perforations [J].

Chasiotis, I ;

Knauss, WG .

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2003, 51 (08) :1551-1572

[6] The mechanical strength of polysilicon films: Part 1. The influence of fabrication governed surface conditions [J].

Chasiotis, I ;

Knauss, WG .

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2003, 51 (08) :1533-1550

[7] Mechanics of thin films and microdevices [J].

Chasiotis, I .

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2004, 4 (02) :176-188

[8] A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy [J].

Ioannis Chasiotis ;

Wolfgang G. Knauss .

Experimental Mechanics, 2002, 42 (1) :51-57

[9] Microtensile tests with the aid of probe microscopy for the study of MEMS materials [J].

Chasiotis, I ;

Knauss, WG .

MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING III, 2000, 4175 :96-103

[10] Mechanical properties of thin polysilicon films by means of probe microscopy [J].

Chasiotis, I ;

Knauss, WG .

MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING, 1998, 3512 :66-75

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