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Cooling performance of a microchannel heat sink with nanofluids

被引：383
作者：
Jang, Seok Pil
Choi, Stephen U. S.
机构：
[1] Argonne Natl Lab, Div Energy Technol, Argonne, IL 60439 USA
[2] Hankuk Aviat Univ, Sch Aerosp & Mech Engn, Goyang 412791, Gyeonggi, South Korea
来源：
APPLIED THERMAL ENGINEERING | 2006年 / 26卷 / 17-18期
基金：
新加坡国家研究基金会;
关键词：
nanofluids; microchannel; heat sink; thermal resistance; nanoparticles;
D O I：
10.1016/j.applthermaleng.2006.02.036
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
In this paper, the cooling performance of a microchannel heat sink with nanoparticle-fluid suspensions ("nanofluids") is numerically investigated. By using a theoretical model of thermal conductivity of nanofluids that accounts for the fundamental role of Brownian motion, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6 nut copper-in-water and 2 nm diamond-in-water. The results show that the cooling performance of a microchannel heat sink with water-based nanofluids containing diamond (1 vol.%, 2 nm) at the fixed pumping power of 2.25 W is enhanced by about 10% compared with that of a microchannel heat sink with water. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant. Finally, the potential of deploying a combined microchannel heat sink with nanofluids as the next generation cooling devices for removing ultra-high heat flux is shown. (c) 2006 Published by Elsevier Ltd.
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收藏
页码：2457 / 2463
页数：7
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