Integration of germanium-on-insulator and silicon MOSFETs on a silicon substrate

被引:60
作者
Feng, Jia [1 ]
Liu, Yaocheng
Griffin, Peter. B.
Plummer, James D.
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
关键词
germanium-on-insulator (GeOI); heterogeneous integration; monolithic integration; MOSFET;
D O I
10.1109/LED.2006.883286
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The monolithic integration of germanium-on-insulator (GeOI) p-MOSFETs with silicon n-MOSFETs on a silicon substrate is demonstrated. The GeOI p-MOSFETs are fabricated on the oxide for silicon device isolation based on the newly developed rapid-melt-growth method. CMOS inverters consisting of the silicon n-MOSFET and GeOI p-MOSFET were obtained, and the measured results show that the processing of high-performance GeOI devices is compatible with bulk-silicon technology.
引用
收藏
页码:911 / 913
页数:3
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