W-band micromachined circuit combining networks

被引:9
作者
Herrick, KJ [1 ]
Katehi, LPB [1 ]
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Radiat Lab, Ann Arbor, MI 49109 USA
关键词
micromachining; microwave circuits; packaging;
D O I
10.1109/TMTT.2002.1006429
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In circuit-combining networks, low-loss interconnecting transmission lines are pivotal in reducing excess loss. Micromachined finite ground coplanar waveguides are used in this study as low-loss interconnects showing significant improvements in line loss while maintaining 50-Omega characteristic impedance. Wilkinson power dividers, reactive tee junctions, and right-angle bends are combined with micromachined interconnects in 1:2, 1:4, and 1:8 power-dividing networks and show measured loss reduction of 0.3-1.0 dB depending on circuit type and size from 85 to 95 GHz.
引用
收藏
页码:1647 / 1651
页数:5
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