Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying

被引：60

作者：

Huang, ML ^{[1
]}

Wu, CML

Lai, JKL

Wang, L

Wang, FG

机构：

[1] City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China

[2] Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2000年 / 11卷 / 01期

关键词：

D O I：

10.1023/A:1008908321027

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The mechanical alloying (MA) processes of tin-9zinc (Sn-9Zn) and tin-5antimony (Sn-5Sb) were analyzed using an X-ray diffractometer, a differential scanning calorimeter (DSC) and a scanning electron microscope (SEM). The results showed that supersaturated solid solution and intermetallic compound were produced during the MA process. The size of powder particles could be controlled under the proper MA conditions and was reduced to 5 to 20 mu m. As a surfactant, proper addition of rosin allows MA to occur smoothly. However, it may also be a source of contamination of the metallic powder. It is considered that MA may be a technique analogous to casting to prepare solder alloys.

引用

页码：57 / 65

页数：9

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