LOCOS-induced stress effects on thin-film SOI devices

被引:27
作者
Huang, CL [1 ]
Soleimani, HR [1 ]
Grula, GJ [1 ]
Sleight, JW [1 ]
Villani, A [1 ]
Ali, H [1 ]
Antoniadis, DA [1 ]
机构
[1] MIT,CAMBRIDGE,MA 02139
关键词
D O I
10.1109/16.563370
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
LOCOS-induced stress effects on thin-film SOI devices are investigated, We shaw that as the field oxide thickness increases, degradation (enhancement) of nMOSFET's (pMOSFET's) I-V characteristics becomes increasingly pronounced. The total degradation or enhancement of I-V characteristics can reach similar to 40% of drive current for devices under certain processing condition, Estimated stress results using four-point bending measurement show that the stress level on the silicon film is of order 1200 MPa for devices with similar to 40% of I-V degradation/enhancement. We attribute the stress phenomenon to the volumetric expansion of held oxide during the LOCOS process.
引用
收藏
页码:646 / 650
页数:5
相关论文
共 9 条
[1]  
[Anonymous], 1988, MAT HDB HYBRID MICRO
[2]  
COLINGE JP, 1991, SILICON INSULATOR
[3]  
*EMIS, 1988, EMIS DAT REV SER, V4, P654
[4]   A NEW ASPECT OF MECHANICAL-STRESS EFFECTS IN SCALED MOS DEVICES [J].
HAMADA, A ;
FURUSAWA, T ;
SAITO, N ;
TAKEDA, E .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (04) :895-900
[5]  
Huang C.-L., 1996, P 1996 IEEE INT SOI, P82
[6]   Isolation process dependence of channel mobility in thin-film SOI devices [J].
Huang, CL ;
Soleimani, H ;
Grula, G ;
Arora, ND ;
Antoniadis, D .
IEEE ELECTRON DEVICE LETTERS, 1996, 17 (06) :291-293
[7]   IMPURITY CENTERS IN SILICON FILMS ON SAPPHIRE [J].
IPRI, AC ;
ZEMEL, JN .
JOURNAL OF APPLIED PHYSICS, 1973, 44 (02) :744-751
[8]   HIGH-MOBILITY FULLY DEPLETED THIN-FILM SOS MOSFET [J].
ROSER, M ;
CLAYTON, SR ;
DELAHOUSSAYE, PR ;
GARCIA, GA .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (11) :2665-2666
[9]  
Shigley JE, 1977, MECH ENG DESIGN