Low-permittivity nanocomposite materials using sculptured thin film technology

被引：17

作者：

Venugopal, VC ^{[1
]}

Lakhtakia, A

Messier, R

Kucera, JP

机构：

[1] Penn State Univ, Dept Engn Sci & Mech, Computat & Theoret Mat Sci CATMAS Grp, University Pk, PA 16802 USA

[2] Penn State Univ, Mech & Mat Res Lab, University Pk, PA 16802 USA

[3] Penn State Univ, Mat Res Lab, University Pk, PA 16802 USA

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2000年 / 18卷 / 01期

关键词：

D O I：

10.1116/1.591146

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The feasibility of using sculptured thin him technology to engineer multiphase low-permittivity (also called low-k) materials for microelectronic and electronic packaging applications is established via a numerical study. The chosen films are theoretically modeled as multiphase, uniaxial, dielectric nanocomposite materials and their anisotropic relative permittivity tensors are estimated using the Bruggeman formalism. (C) 2000 American Vacuum Society. [S0734-211X(00)04901-5].

引用

页码：32 / 36

页数：5

共 27 条

[1]

[Anonymous], 1972, ELEMENTARY NUMERICAL

[2] Glancing angle deposition: Recent research results [J].

Brett, MJ ;

Seto, MW ;

Sit, JC ;

Harris, KD ;

Vick, D ;

Robbie, K .

ENGINEERED NANOSTRUCTURAL FILMS AND MATERIALS, 1999, 3790 :114-118

[3]

Chen H C., 1983, Theory of Electromagnetic Waves

[4] Application of fluorinated amorphous carbon thin films for low dielectric constant interlayer dielectrics [J].

Endo, K ;

Tatsumi, T ;

Matsubara, Y ;

Horiuchi, T .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (4A) :1809-1814

[5] Novel low k dielectrics based on diamondlike carbon materials [J].

Grill, A ;

Patel, V ;

Jahnes, C .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (05) :1649-1653

[6] Overview of process integration issues for low K dielectrics [J].

Havemann, RH ;

Jain, MK ;

List, RS ;

Ralston, AR ;

Shih, WY ;

Jin, C ;

Chang, MC ;

Zielinski, EM ;

Dixit, GA ;

Singh, A ;

Russell, SW ;

Gaynor, JF ;

McKerrow, AJ ;

Lee, WW .

LOW-DIELECTRIC CONSTANT MATERIALS IV, 1998, 511 :3-14

[7] Low dielectric constant materials and methods for interlayer dielectric films in ultralarge-scale integrated circuit multilevel interconnections [J].

Homma, T .

MATERIALS SCIENCE & ENGINEERING R-REPORTS, 1998, 23 (06) :243-285

[8]

HRUBESH LW, 1995, MATER RES SOC SYMP P, V381, P267, DOI 10.1557/PROC-381-267

[9]

LAKHTAKA A, 1999, P SPIE, V3790

[10]

Lakhtakia A, 1999, MICROW OPT TECHN LET, V21, P286, DOI 10.1002/(SICI)1098-2760(19990520)21:4<286::AID-MOP16>3.0.CO

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